CAS 1590-87-0|disilane|Disilane|disilane|乙硅烷|Disilane|disilane|Si2H6

InChI=1S/H6Si2/c1-2/h1-2H3

PZPGRFITIJYNEJ-UHFFFAOYSA-N

LogD (pH = 7.4)

-1.87

LogD (pH = 5.5)

-1.87

Log P

-1.87

Rotatable Bonds

H Donor

H Acceptors

Lipinski's Rule of Five

true

Polar Surface Area

0.00

Polarizability

5.70

Molar Refractivity

4.80

LOG S

0.56

Disilane乙硅烷DisilanedisilaneSi2H6

IUPAC Traditional name

Extremely flammable

Danger

UN 3161 2.1

16-24-26-36/37/39

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463043

Features and Benefits
Disilane is used for the deposition of amorphous silicon, epitaxial silicon and silicon based dielectrics via rapid low-temperature chemical vapor depsition (LTCVD).2 Disilane is also used in the epitaxial growth of SiGe films by molecular beam epitaxy (MBE) in conjunction with solid sources of germanium.3 Precursor for the rapid, low temperature deposition of epitaxial silicon and silicon-based dielectrics.4
General description
Atomic number of base material: 14 Silicon
Packaging
20 g in ss cylinder
Application
Precursor for the rapid, low temperature deposition of epitaxial silicon and silicon-based dielectrics.1
Recommended products
Stainless steel regulators Z527416 or Z527424 are recommended.

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