Substance
ID:308912
Names and Identifiers
IUPAC name
titanium
IUPAC Traditional name
titanium
Synonyms
Titanium钛
Properties
Product Information
Purity
99.995% trace metals basis
Empirical Formula (Hill Notation)
Ti
Diam. × Thickness
3.00 in. × 0.125 in.
Safety Information
MSDS Link
Physical Property
Boiling Point
3287 °C(lit.)
Density
4.5 g/mL at 25 °C(lit.)
Resistivity
42.0 μΩ-cm, 20°C
Auto Ignition Point
860 °F
Melting Point
1660 °C(lit.)
Molecule Details
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
包装
1 ea in rigid mailer
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
包装
1 ea in rigid mailer
Molecular Spectra
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References
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