Substance
ID:308911
Names and Identifiers
IUPAC name
alumane
IUPAC Traditional name
alumane
Synonyms
Aluminum铝
Properties
Product Information
Purity
99.9995% trace metals basis
Empirical Formula (Hill Notation)
Al
Diam. × Thickness
3.00 in. × 0.125 in.
Physical Property
Melting Point
660.37 °C(lit.)
Density
2.7 g/mL at 25 °C(lit.)
Auto Ignition Point
1400 °F
Boiling Point
2460 °C(lit.)
Resistivity
2.6548 μΩ-cm
Safety Information
MSDS Link
Molecule Details
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
包装
1 ea in rigid mailer
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
包装
1 ea in rigid mailer
Molecular Spectra
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References
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