Substance
ID:306519
Names and Identifiers
IUPAC name
gold
IUPAC Traditional name
gold
Synonyms
镀金硅片Gold coated silicon wafer
Registration numbers
MDL Number
Properties
Product Information
Purity
99.999% (Au)
99.99% (Ti)
Diam. × Thickness
4 in. × 500 μm
Linear Formula
Au
Matrix Attachment
Titanium, as adhesion layer used to bind the gold to the borosilicate glass cover slip
Layer Thickness
1000 Å
Safety Information
German water hazard class
3
MSDS Link
Molecule Details
General description
Titanium adhesion layer used to bind the gold to a silicon wafer <100>. Gold orientation is nominally highly polycrystalline with a preference to <111> orientation.1
Packaging
1 ea in padded box
Packaging 1 set in single wafer shipper
Titanium adhesion layer used to bind the gold to a silicon wafer <100>. Gold orientation is nominally highly polycrystalline with a preference to <111> orientation.1
Packaging
1 ea in padded box
Packaging 1 set in single wafer shipper
Molecular Spectra
No Data Available
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References
No Data Available
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